{"cmr":"jp-cm-kg/TSE-STANDARD/8023","since":null,"total":12,"cursor":0,"limit":50,"next_cursor":null,"events":[{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-09-09","event_type":"corporate_news","title":"自己株券買付状況報告書（法２４条の６第１項に基づくもの）","reference":"S100Z154","category":"自己株券買付状況報告書 (share buy-back status report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100Z154","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 220 自己株券買付状況報告書 (share buy-back status report); formCode 170000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"-cCWEq_D5Ca-ntZScemqfoYZwaEv7ZGHfEhJfORIOh_il4CjVQsOkRhArbgye9PRiZsxso4-mqJtpYylTkCWDw","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-08-12","event_type":"prospectus","title":"訂正有価証券届出書（組込方式）","reference":"S100YVR3","category":"040","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YVR3","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 040 ; formCode 022001; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"_xRTAdCBm-fAvy8cw5LGVmtstwPKKqSTJ7PSkhThacGTRE4Z73OJ--avRUwdKHkqNpgyokttHJwOti3JvHpvDQ","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-08-10","event_type":"prospectus","title":"有価証券届出書（組込方式）","reference":"S100YVQN","category":"有価証券届出書 (securities registration statement)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YVQN","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 030 有価証券届出書 (securities registration statement); formCode 022000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"9isdp6OXD3KMoi520X0p9E2LYHjSodjlv63rZi6Re7vhZAg0f8o0KHxH6NghpWdJAHNo7rzPHW0RKtiJQBmxBw","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-06-30","event_type":"ad_hoc","title":"臨時報告書","reference":"S100YNP7","category":"臨時報告書 (extraordinary report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YNP7","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 180 臨時報告書 (extraordinary report); formCode 053000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"N5qrAdmOUpTukYUDvBe8Mvv9e8XJOoUhv6qErUbWmfCzTg0ag3zqIIehPniHzjn4U2wbxjD0P4bJoYUvY9XDCg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-06-24","event_type":"regulatory_filing","title":"確認書","reference":"S100YIYC","category":"135","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YIYC","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 135 ; formCode 042000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"GYv13a8dXdkKwtYgU94qm5VK6fRKe6L7uM39PwpbhBVbvyvNIbB62wk5_CNRyEGzbp25ZHKBihNY6Oo-PHYsCg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-06-24","event_type":"regulatory_filing","title":"内部統制報告書－第73期(2025/04/01－2026/03/31)","reference":"S100YIYJ","category":"235","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YIYJ","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 235 ; formCode 010000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 015","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"VlqJaDcmwaKix5sBAi-Ils-so30yurpVlssMEFJPuCMc5X8bc175ORGJ7-_0BQMIj-tGdptBoyToL-HHBgzgDg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2026-06-24","event_type":"results","title":"有価証券報告書－第73期(2025/04/01－2026/03/31)","reference":"S100YIXP","category":"有価証券報告書 (annual securities report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100YIXP","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 120 有価証券報告書 (annual securities report); formCode 030000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period 2025-04-01..2026-03-31; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"Y1AJczRx8tc6YhU04lPwZHqHNFoeIIBatR1bs8xUQKL29l5lBxYrdrWa3s0YbVYCmY1coUQXNdy8cPeU-26KDw","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2025-12-10","event_type":"corporate_news","title":"自己株券買付状況報告書（法２４条の６第１項に基づくもの）","reference":"S100X9AR","category":"自己株券買付状況報告書 (share buy-back status report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100X9AR","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 220 自己株券買付状況報告書 (share buy-back status report); formCode 170000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"u6ZGU8RJtBCXaZlaoGccYw8PkEr_e3Rz6_AOEuKWLCUqsXtEVuPHna28PY2CyZ3aCSOjgJobufAqWqIjlPVxAA","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2025-11-12","event_type":"regulatory_filing","title":"確認書","reference":"S100X0KF","category":"135","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100X0KF","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 135 ; formCode 042000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"L95q00CSKcsHIt6uzZxKQ_JsLnLDeU5RBMYsLwx67QwX-WQoSOjDtRO7UK0yPmYRuxF65rLYZCDOu5l1rAehDg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2025-11-12","event_type":"results","title":"半期報告書－第73期(2025/04/01－2026/03/31)","reference":"S100X0K2","category":"半期報告書 (half-year report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100X0K2","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 160 半期報告書 (half-year report); formCode 043A00; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period 2025-04-01..2026-03-31; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"AMWQ7ctbV_4TEc_39CyaE_O4wJ08qEp92Ax6AFsV4dWOOmnhkfWw100tSKmmXZFR1LnZrH-A13rmOzYcMQHIAg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2025-11-10","event_type":"corporate_news","title":"自己株券買付状況報告書（法２４条の６第１項に基づくもの）","reference":"S100X0SH","category":"自己株券買付状況報告書 (share buy-back status report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100X0SH","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 220 自己株券買付状況報告書 (share buy-back status report); formCode 170000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"5dHiGzYWjt_XKNVnvM1G0zg6qGzJkYcxDmJhC-ZQg6WopQQEW10ArO3FsQZwlJyX5fTAKUc4OvN9zJwusp5CBw","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}},{"cmr":"jp-cm-kg/TSE-STANDARD/8023","date":"2025-10-14","event_type":"corporate_news","title":"自己株券買付状況報告書（法２４条の６第１項に基づくもの）","reference":"S100WUUH","category":"自己株券買付状況報告書 (share buy-back status report)","language":"ja","wire":"EDINET","source":"EDINET (統合開示システム) — statutory filing","url":"https://disclosure2.edinet-fsa.go.jp/WZEK0040.aspx?S100WUUH","read_by":"EDINET API v2 documents list (statutory filings per EDINET code)","detail":"docTypeCode 220 自己株券買付状況報告書 (share buy-back status report); formCode 170000; filer ＤＡＩＫＯ　ＸＴＥＣＨ株式会社; period None..None; secCode 80230; ordinance 010","signature":{"alg":"EdDSA","kid":"allooloo-cmr-2026-10","protected":"eyJhbGciOiJFZERTQSIsImtpZCI6ImFsbG9vbG9vLWNtci0yMDI2LTEwIn0","signature":"0uld1UQOUrWVtCMm7PYmKEMpc6sXlW-vv4XBoMLk7wSybpUGWCjYJrubbFBIAPkeS3JAfzmyNOW0sewsHwNsCg","jwks":"https://allooloo.ai/.well-known/jwks.json","over":"base64url(protected) + '.' + base64url(canonical JSON of the record without signature: keys sorted, compact)"}}],"events_signed":"allooloo-cmr-2026-10"}